SEMICONDUCTOR PRODUCTION SYSTEM

We strive to create a production system that is globally competitive in term of quality and productivity. We can provide products with appropriate production lines or management depending on customer need. The capability is a result of our optical alignment and high precision assembly technologies, which can produce optical devices for communication applications.

Chip test / Dicing test
Die bonding / Wire bonding
Molding
Lead forming
Testing / Marking / Visual Inspection / Taping
Manufacturing Monitoring System
Chip test / Dicing test
Die bonding / Wire bonding
Molding
Lead forming
Testing / Marking / Visual Inspection / Taping
Manufacturing Monitoring System
Semiconductor Production System

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